China Hot Selling for Electronics Manufacturing Service - FPC with steinless steel stiffener – Pandawill factory and manufacturers

Hot Selling for Electronics Manufacturing Service - FPC with steinless steel stiffener – Pandawill

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Hot Selling for Electronics Manufacturing Service - FPC with steinless steel stiffener – Pandawill Detail:

Product Details

Layers	2 layers
Board thickness	0.15MM
Material	Polyimide
Copper thickness	1 OZ(35um)
Surface Finish	ENIG immersion gold
Thickness of the copper foil	18/18um
Cu plated thickness	35um
Hole Cu thickness	20um
PI thickness	25um
Coverlay thickness	37.5um
Stiffener	Steinless steel 0.2mm
Min Hole(mm)	0.25mm
Min Line Width(mm)	0.15mm
Min Line Space(mm)	0.12mm
Solder Mask	Yellow
Legend Color	White
Mechanical processing	Laser Cutting
E-test	Flying probe or Fixture
Acceptance standard	IPC-6013B; IPC-A-600H; ASF-WI-QA012; IPC-TM-650
Application	Telecom

1. Introduction

Flexible printed circuits

Flexible printed circuits have become established in recent years as a medium for circuits.

The main users of flexible printed circuits are the technological sectors which need the following characteristics and benefits:

Implementation of compact, complex assemblies which minimise size and weight

Dynamically and mechanically robust when bent

Defined characteristics of the circuit systems on the circuit board (impedances and resistances)

Reliability of the electrical connections by minimising the number of connections between the modules

Saving connectors and wiring, also cost-saving by lowering the costs for component placement and assembly

2. Materials

Flexible base material: As a base material, PANDAWILL uses exclusively polyimide film which, compared to the alternative PET and PEN films has the advantage of a high processing temperature range, unrestricted solderability as well as the large operating temperature range. Depending on the requirements for the product and process, differing versions of film are used.

Polyimide thickness	25 µm, 50 µm, 100 µm	PANDAWILL standard: 50 µm
Copper	Single or double sided
	18 µm, 35 µm, 70 µm	PANDAWILL standard: 18 µm or 35 µm
	Rolled copper (RA)	Suitable for dynamic, flexible applications
	Electrolytically deposited copper (ED)	Low elongation after fracture, only suited for static and semi-dynamic applications
Adhesive systems	Acrylic adhesive	For dynamical, flexible applications, not UL 94 V-0 listed
	Expoy adhesive	Limited dynamic flexibility, UL 94 V-0 listed
	Adhesive free	PANDAWILL standard, high flexibility, chemical resistance, and is UL 94 V-0 listed

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