China Good User Reputation for Pcb Layout Rules - 14 layer Panasonic MEGTRON4 PCIE board for Intel – Pandawill factory and manufacturers

Good User Reputation for Pcb Layout Rules - 14 layer Panasonic MEGTRON4 PCIE board for Intel – Pandawill

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Good User Reputation for Pcb Layout Rules - 14 layer Panasonic MEGTRON4 PCIE board for Intel – Pandawill Detail:

Product Details

Layers	14 layers
Board thickness	1.60MM
Material	Panasonic MEGTRON4 R-5725
Copper thickness	1 OZ(35um)
Surface Finish	ENIG finish
Min Hole(mm)	0.20mm; via plugged with resin
Min Line Width(mm)	0.13mm
Min Line Space(mm)	0.13mm
Solder Mask	TAIYOPSR4000 RD5 birght red
Legend Color	White
Impedance	Single Impedance & Differential Impedance
Packing	Anti-static bag
E-test	Flying probe or Fixture
Acceptance standard	IPC-A-600H Class 2
Application	PCIE ICT industrial device

Introduction

Multilayer
In this section, we would like to supply you with basic details about the structural options, tolerances, materials, and layout guidelines for multilayer boards. This should make your life easier as a developer and help to design your printed circuit boards so that they are optimized for manufacturing at lowest cost.

General details

	Standard
Maximum circuit size	508mm X 610mm (20″ X 24″)
Number of layers	to 28 layers
Pressed thickness	0.4 mm – 4.0mm

PCB Materials
As a supplier of various PCB technologies, volumes, lead time options, we have a selection of standard materials with which a large bandwidth of the variety of types of PCB can be covered and which are always available in house.
Requirements for other or for special materials can also be met in most cases, but, depending upon the exact requirements, up to about 10 working days may be needed to procure the material.
Do get in touch with us and discuss your needs with one of our sales or CAM team.
Standard materials held in stock:

Components	Thickness
Internal layers	0,05mm
Internal layers	0.10mm
Internal layers	0,13mm
Internal layers	0,15mm
Internal layers	0.20mm
Internal layers	0,25mm
Internal layers	0.30mm
Internal layers	0.36mm
Internal layers	0,41mm
Internal layers	0,51mm
Internal layers	0,61mm
Internal layers	0.71mm
Internal layers	0,80mm
Internal layers	1,0mm
Internal layers	1,2mm
Internal layers	1,55mm

Prepregs	0.058mm*
Prepregs	0.084mm*
Prepregs	0.112mm*
Prepregs	0.205mm*

Cu thickness for internal layers: Standard – 18µm and 35 µm,on request 70 µm, 105µm and 140µm
Material type: FR4
Tg: approx. 150°C, 170°C, 180°C
εr at 1 MHz: ≤5,4 (typical: 4,7) More available on request

Stack up
PCB stack-up is an important factor in determining the EMC performance of a product. A good stack-up can be very effective in reducing radiation from the loops on the PCB, as well as the cables attached to the board.

our factors are important with respect to board stack-up considerations:

1. The number of layers,

2. The number and types of planes (power and/or ground) used,

3. The ordering or sequence of the layers, and

4. The spacing between the layers.

Usually not much consideration is given except as to the number of layers. In many cases the other three factors are of equal importance. In deciding on the number of layers, the following should be considered:

1. The number of signals to be routed and cost,

2. Frequency

3. Will the product have to meet Class A or Class B emission requirements?

Often only the first item is considered. In reality all the items are of critical importance and should be considered equally. If an optimum design is to be achieved in the minimum amount of time and at the lowest cost, the last item can be especially important and should not be ignored.