FPC flexible circuit with 3M stiffener & dome
Product Details
| Layers | 2 layers |
| Board thickness | 0.15MM |
| Material | Polyimide |
| Copper thickness | 1 OZ(35um) |
| Surface Finish | ENIG immersion gold |
| Thickness of the copper foil | 18/18um |
| Cu plated thickness | 35um |
| Hole Cu thickness | 20um |
| PI thickness | 25um |
| Coverlay thickness | 37.5um |
| Stiffener | 3M tape 9079; Steinless steel; Dome switch; thickness:0.375mm |
| Min Hole(mm) | 0.25mm |
| Min Line Width(mm) | 0.20mm |
| Min Line Space(mm) | 0.18mm |
| Solder Mask | Yellow |
| Legend Color | White |
| Mechanical processing | Laser Cutting |
| E-test | Flying probe or Fixture |
| Acceptance standard | IPC-6013B; IPC-A-600H; ASF-WI-QA012; IPC-TM-650 |
| Application | Telecom |
1. Introduction
Flexible printed circuits
Flexible printed circuits have become established in recent years as a medium for circuits.
The main users of flexible printed circuits are the technological sectors which need the following characteristics and benefits:
Implementation of compact, complex assemblies which minimise size and weight
Dynamically and mechanically robust when bent
Defined characteristics of the circuit systems on the circuit board (impedances and resistances)
Reliability of the electrical connections by minimising the number of connections between the modules
Saving connectors and wiring, also cost-saving by lowering the costs for component placement and assembly
2. Materials
Flexible base material: As a base material, PANDAWILL uses exclusively polyimide film which, compared to the alternative PET and PEN films has the advantage of a high processing temperature range, unrestricted solderability as well as the large operating temperature range. Depending on the requirements for the product and process, differing versions of film are used.
| Polyimide thickness | 25 µm, 50 µm, 100 µm | PANDAWILL standard: 50 µm |
| Copper | Single or double sided | |
| 18 µm, 35 µm, 70 µm | PANDAWILL standard: 18 µm or 35 µm | |
| Rolled copper (RA) | Suitable for dynamic, flexible applications | |
| Electrolytically deposited copper (ED) | Low elongation after fracture, only suited for static and semi-dynamic applications | |
| Adhesive systems | Acrylic adhesive | For dynamical, flexible applications, not UL 94 V-0 listed |
| Expoy adhesive | Limited dynamic flexibility, UL 94 V-0 listed | |
| Adhesive free | PANDAWILL standard, high flexibility, chemical resistance, and is UL 94 V-0 listed |
