bidirectional RF & Microwave Power amplifier
Product Details
| Layers | 12 layers |
| Board thickness | 1.60 MM |
| Material | ITEQ IT-180A FR-4（TG≥170℃) |
| Copper thickness | 1 OZ(35um) |
| Surface Finish | Immersion Gold; Au Thickness 0.05 um; Ni Thickness 3um |
| Min Hole(mm) | 0.20mm |
| Min Line Width(mm) | 0.109mm |
| Min Line Space(mm) | 0.216mm |
| Solder Mask | Green |
| Legend Color | White |
| Board size | 250*162mm |
| PCB Assembly | Mixed surface mount & through hole assembly |
| RoHS Complied | Lead free assembly process |
| Min components size | 0402 |
| Total components | 1695 per board |
| IC Package | BGA; QFN |
| Main IC | Atmel, picochip, Altera, U-blox |
| Test | AOI, X-Ray, Functional test |
| Application | Telecom |
With more than 15 years experience as Electronic manufacturing service provider for Telecommunication, we support various devices and telecommunication protocols:
> Computing devices & equipment
> Servers & routers
> RF & Microwave
> Data centers
> Data storage
> Fiber optic devices
> Transceivers and transmitters
Connected devices, computing, networking… with various telecommunication protocols making it all possible. Thanks to our contract manufacturer experience for years, we bring high end design, engineering and manufacturing services to the telecommunication industry. With more than 15 years experience in this very specific market, at Pandawill, EMS company, we have developed a thorough knowledge of this industry.
Telecommunication and data processing are the backbone of the connected devices and cloud era we are witnessing, transforming the way we live at a global scale.
From supplying the highly reliable telecommunication equipment and integration to support a robust infrastructure and network, or manufacturing the cutting edge telecommunication devices interacting with complex and diverse telecommunication protocols, we mastered over time printed circuit board assembly (PCBA), manufacturing and the testing of telecommunication equipment.
At Pandawill, we understand the complexity and challenge in this industry, that is why we have become experts in electronic manufacturing services (EMS) for telecommunication.
In our smart factories, our engineers and expert manufacture products by combining advanced engineering intelligence, PCB prototyping and test engineering with DfT analysis (Design for Test).
In our smart factories, our engineers and experts manufacture products by combining advanced engineering intelligence, PCB prototyping and test engineering with DfT analysis (Design for Test).
