2018 Latest Design Immersion Gold Circuit Board - FPC with steinless steel stiffener – Pandawill
2018 Latest Design Immersion Gold Circuit Board - FPC with steinless steel stiffener – Pandawill Detail:
Product Details
| Layers | 2 layers |
| Board thickness | 0.15MM |
| Material | Polyimide |
| Copper thickness | 1 OZ(35um) |
| Surface Finish | ENIG immersion gold |
| Thickness of the copper foil | 18/18um |
| Cu plated thickness | 35um |
| Hole Cu thickness | 20um |
| PI thickness | 25um |
| Coverlay thickness | 37.5um |
| Stiffener | Steinless steel 0.2mm |
| Min Hole(mm) | 0.25mm |
| Min Line Width(mm) | 0.15mm |
| Min Line Space(mm) | 0.12mm |
| Solder Mask | Yellow |
| Legend Color | White |
| Mechanical processing | Laser Cutting |
| E-test | Flying probe or Fixture |
| Acceptance standard | IPC-6013B; IPC-A-600H; ASF-WI-QA012; IPC-TM-650 |
| Application | Telecom |
1. Introduction
Flexible printed circuits
Flexible printed circuits have become established in recent years as a medium for circuits.
The main users of flexible printed circuits are the technological sectors which need the following characteristics and benefits:
Implementation of compact, complex assemblies which minimise size and weight
Dynamically and mechanically robust when bent
Defined characteristics of the circuit systems on the circuit board (impedances and resistances)
Reliability of the electrical connections by minimising the number of connections between the modules
Saving connectors and wiring, also cost-saving by lowering the costs for component placement and assembly
2. Materials
Flexible base material: As a base material, PANDAWILL uses exclusively polyimide film which, compared to the alternative PET and PEN films has the advantage of a high processing temperature range, unrestricted solderability as well as the large operating temperature range. Depending on the requirements for the product and process, differing versions of film are used.
| Polyimide thickness | 25 µm, 50 µm, 100 µm | PANDAWILL standard: 50 µm |
| Copper | Single or double sided | |
| 18 µm, 35 µm, 70 µm | PANDAWILL standard: 18 µm or 35 µm | |
| Rolled copper (RA) | Suitable for dynamic, flexible applications | |
| Electrolytically deposited copper (ED) | Low elongation after fracture, only suited for static and semi-dynamic applications | |
| Adhesive systems | Acrylic adhesive | For dynamical, flexible applications, not UL 94 V-0 listed |
| Expoy adhesive | Limited dynamic flexibility, UL 94 V-0 listed | |
| Adhesive free | PANDAWILL standard, high flexibility, chemical resistance, and is UL 94 V-0 listed |
Product detail pictures:
Related Product Guide:
Assume full responsibility to meet all demands of our clients; achieve continuous advancements by promoting the growth of our clients; become the final permanent cooperative partner of clients and maximize the interests of clients for 2018 Latest Design Immersion Gold Circuit Board - FPC with steinless steel stiffener – Pandawill , The product will supply to all over the world, such as: Bulgaria, Cyprus, Albania, Our company abides by the management idea of "keep innovation, pursue excellence". On the basis of assuring the advantages of existing products, we continuously strengthen and extend product development. Our company insists on innovation to promote the sustainable development of enterprise, and make us become the domestic high-quality suppliers.
By Fanny from Juventus - 2018.11.02 11:11
The factory technical staff not only have high level of technology, their English level is also very good, this is a great help to technology communication.
By Roxanne from Algeria - 2018.11.06 10:04
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